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Ltd. is one of the high-speed series circuit boards developed and produced by Shenzhen Dafengwang Electronics Co., Ltd. It adopts the production process of Lianmao IT170GRA1TC high-speed material pure pressing, surface gold sinking and gold finger sinking thick gold, etc. It is widely used in high-speed computer and cloud data center high-end server field, and the product has the characteristics of stability and durability.
Layer:14L
Material: Lianmao IT170GRA1TC
Plate thickness:1.6±0.05mm
Copper thickness:1oz
Surface treatment: sunken gold, thickness: 0.05um + gold finger, thickness 15u"
Outer layer line width/line spacing:75/75um
Minimum aperture: mechanical hole: 0.2mm, plate thickness aperture ratio: 8:1
Soldermask character color:green oil white
Prev：High density high speed circuit boards
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
