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6-layer 2nd order HDI blind buried hole semiconductor PCB test board
  • 6-layer 2nd order HDI blind buried hole semiconductor PCB test board
  • 6-layer 2nd order HDI blind buried hole semiconductor PCB test board
6-layer 2nd order HDI blind buried hole semiconductor PCB test board

6-layer 2nd order HDI PCB test board, also called 6-layer 2nd order blind buried hole PCB semiconductor test board, is a kind of 2nd order HDI semiconductor test board developed and produced by Shenzhen Dafengwang Electronics Co. The HDI circuit board is made of SangYi S1000-2M substrate, and after the PCB manufacturing process such as laser drilling and surface gold plating, the aperture can reach 0.1mm and the line width/line spacing can reach 75/75um, and the product is widely used in semiconductor test field.

Number of layers:6L


Material:S1000-2M


Plate thickness:2.0mm±0.15mm


Copper thickness:1oz


Surface treatment:sunken gold 2u"


Outer layer line width/line spacing:75um/75um


Minimum hole diameter:0.1mm


Solder resist character color: green oil white character


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