 |
Communication PCB backplane is one of the series of communication backplane PCBs developed and produced by Shenzhen Dafengwang Electronics Co., Ltd. and is produced by S1000-2M and surface deposition gold and other processes. The circuit board is widely used in the field of network communication such as large routers and switches.
Layer:18L
Material: S1000-2M
Plate thickness:3
Copper thickness:70um
Surface treatment: sunken gold (gold thickness: 0.05um)
Outer layer line width/line spacing:3./3mil
Minimum hole diameter:0.25mm
Solder resist character color: green oil white character
Prev：22-layer high-speed communication backplane
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
