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The 22-layer communication backplane is one of the series of communication PCB backplanes developed and produced by Shenzhen Dafengwang Electronics Co. This type of PCB is widely used in large routers and switches and other network communication fields.
Number of layers:22L
Material: S1000-2M
Plate thickness:4.0mm
Copper thickness:70um
Surface treatment: Immersion gold
Outer layer line width/line spacing:3.2/3.2mil
Minimum hole diameter:0.25mm
Solder resist character color: green oil white character
Next：22-layer high-speed communication backplane
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
