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The 3rd order 5G IoT HDI PCB board is one of the series of 3rd order HDIPCB boards developed and produced by Shenzhen Dafengwang Electronics Co. This HDI circuit board is widely used in the field of 5G IoT.
Layer:8L
Material: raw benefit S1000-2M
Plate thickness:1.0+0.1mm
Copper thickness:1oz
Surface treatment: sunken gold + OSP
Outer layer line width/line spacing:55/55um
Minimum aperture: laser hole: 0.1mm; mechanical hole: 0.20mm, aperture ratio: 8:1
Solder resist character color:green oil white character
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
