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UAV 3-stage 10-layer HDI buried blind hole circuit board is one of the series of 3-stage HDIPCB blind buried hole board developed and produced by Shenzhen Dafengwang Electronics Co.
Layer:10L
Material: Sheng Yi S1000-2M
Plate thickness:1.0±0.1mm
Copper thickness:1oz
Surface treatment: sunken gold, thickness: 0.05um
Outer layer line width/line spacing:75/95um
Minimum aperture: laser blind hole: 0.1mm, mechanical hole: 0.2mm, plate thickness aperture ratio of 5:1
Solder blocking character color: black oil white character
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
