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Ltd. is one of the series of 3rd order HDIPCB circuit boards developed and produced by Shenzhen Dafengwang Electronics Co. This type of HDI circuit board is widely used in the field of smart phones.
Layer:12L
Material: Sheng Yi S1000-2M
Plate thickness:1.2±0.1mm
Copper thickness:1oz
Surface treatment: sunken gold + OSP
Outer layer line width/line spacing:65/65um
Minimum hole diameter: laser hole: 0.1mm
Solder resist character color: green oil white character
Next：Drone 3-stage 10-layer HDI buried blind hole circuit board
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
