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The 12-layer RF PCB is one of the 3-stage HDI PCB series developed and produced by Shenzhen Dafengwang Electronics Co.
Layer:12L
Material: Rogers RO4350B+Taiyao TU-768
Board thickness:1.7±0.17mm
Copper thickness:1oz
Surface treatment: sunken gold, thickness: 0.05um
Outer layer line width/line spacing:110/90um
Minimum hole diameter: mechanical hole: 0.2mm, plate thickness hole diameter ratio 8.5:1
Solder resist character color: green oil white character
Next：14 layer high aspect ratio semiconductor test thick gold plate
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
