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14 layer high aspect ratio semiconductor test thick gold plate
  • 14 layer high aspect ratio semiconductor test thick gold plate
  • 14 layer high aspect ratio semiconductor test thick gold plate
14 layer high aspect ratio semiconductor test thick gold plate

14-layer high thickness to diameter ratio semiconductor test thick gold board is a series of semiconductor test high level PCBs developed and produced by Shenzhen Dafengwang Electronics Co.

Layer:14L


Material: raw benefit S1000-2M


Plate thickness:5.0mm+0.5mm


Copper thickness:1oz


Surface treatment: gold plated 5u"


Outer layer line width/line spacing:100/90um


Minimum hole diameter: mechanical hole: 0.35mm plate thickness hole diameter ratio: 14:1


Solder resist character color: green oil white character


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Shenzhen Dafengwang Electronics Co., Ltd
Contact: Ms. Chen
Mobile phone: 13530785158

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