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High aspect ratio semiconductor thick gold PCB
  • High aspect ratio semiconductor thick gold PCB
  • High aspect ratio semiconductor thick gold PCB
High aspect ratio semiconductor thick gold PCB

16-layer high thickness-to-diameter ratio semiconductor thick gold PCB board is one of the series of high-rise PCB boards developed and produced by Shenzhen Dafengwang Electronics Co., Ltd, mainly used in the field of semiconductor testing, 16-layer structure, using the raw benefit S1000-2M material, the whole board plating thick gold production process.

Layer:16L


Material: Sheng Yi S1000-2M S1000-2M


Plate thickness:6.5mm±0.3mm


Copper thickness:1oz


Surface treatment: whole board plated with thick gold 50u"


Outer layer line width/line spacing:250/250um


Minimum hole diameter: mechanical hole: 0.45mm plate thickness hole diameter ratio: 14:1


Solder resist character color:blue oil white character


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Shenzhen Dafengwang Electronics Co., Ltd
Contact: Ms. Chen
Mobile phone: 13530785158

Email: coco@dfwdz.com

Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.szdfwpcb.com
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